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april 2006 rev 5 1/24 1 m27c801 8 mbit (1mb x 8) uv eprom and otp eprom features 5v 10% supply voltage in read operation access time: 45 ns low power consumption: ? active current: 35 ma at 5 mhz ? standby current: 100 a programming voltage: 12.75v 0.25v programming time: 50 s/word electronic signature ? manufacturer code: 20h ? device code: 42h ecopack? packages available 1 32 32 1 fdip32w (f) pdip32 (b) plcc32 (k) tsop32 (n) 8 x 20 mm www.st.com
contents m27c801 2/24 contents 1 summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 two-line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 system considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.5 programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.6 presto iib programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.7 program inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.8 program verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.9 electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.10 erasure operation (applies to uv eprom) . . . . . . . . . . . . . . . . . . . . . . . 11 3 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 dc and ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.1 32-pin ceramic frit-seal dip, with round window (fdip32wa) . . . . . . . . 18 5.2 32-pin plastic dip, 600 mils width (pdip32) . . . . . . . . . . . . . . . . . . . . . . . 19 5.3 32-lead rectangular plastic leaded chip carrier (plcc32) . . . . . . . . . . 20 5.4 32-lead plastic thin small outline, 8x20 mm (tsop32) . . . . . . . . . . . . . 21 6 part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
m27c801 list of tables 3/24 list of tables table 1. signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 2. operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 3. electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 4. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 5. read mode dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 6. programming mode dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 7. ac measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 8. capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 9. read mode ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 10. read mode ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 11. margin mode ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 12. programming mode ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 table 13. fdip32wa package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 table 14. pdip32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 9 table 15. plcc32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 table 16. tsop32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 table 17. ordering information scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 18. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
list of figures m27c801 4/24 list of figures figure 1. logic diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. dip connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 3. plcc connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 4. tsop connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 5. programming flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 6. ac testing input output waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 figure 7. ac testing load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 8. read mode ac waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 9. margin mode ac waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 10. programming and verify modes ac waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 11. fdip32wa package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 12. pdip32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 13. plcc32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 14. tsop32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
m27c801 summary description 5/24 1 summary description the m27c801 is an 8 mbit eprom offered in the two ranges uv (ultra violet erase) and otp (one time programmable). it is ideally su ited for applications where fast turn-around and pattern experimentation are important requirements and is organized as 1,048,576 by 8 bits. the fdip32w (window ceramic frit-seal package) has transparent lid which allows the user to expose the chip to ultraviolet light to erase the bit pattern. a new pattern can then be written to the device by following the programming procedure. for applications where the content is programmed only one time and erasure is not required, the m27c801 is offered in pdip32, plcc32 and tsop32 (8 x 20 mm) packages. in order to meet environmental requirements, st offers the m27c801 in ecopack? packages. ecopack packages are lead-free. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack? specifications are available at: www.st.com. see figure 1: logic diagram and table 1: signal descriptions for a brief overview of the signals connected to this device. figure 1. logic diagram ai01267 20 a0-a19 q0-q7 v cc m27c801 v ss 8 gv pp e
summary description m27c801 6/24 figure 2. dip connections table 1. signal descriptions signal description a0-a19 address inputs q0-q7 data outputs e chip enable g v pp output enable / program supply v cc supply voltage v ss ground a1 a0 q0 a7 a4 a3 a2 a6 a5 a13 a10 a8 a9 q7 a14 a11 gv pp e q5 q1 q2 q3 v ss q4 q6 a17 a18 a16 a12 a19 v cc a15 ai01268 m27c801 8 1 2 3 4 5 6 7 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
m27c801 summary description 7/24 figure 3. plcc connections figure 4. tsop connections ai01814 a17 a8 a10 q5 17 a1 a0 q0 q1 q2 q3 q4 a7 a4 a3 a2 a6 a5 9 a18 a9 1 a16 a11 a13 a12 q7 32 a19 v cc m27c801 a15 a14 q6 gv pp e 25 v ss a1 a0 q0 a7 a4 a3 a2 a6 a5 a13 a10 a8 a9 q7 a14 a11 gv pp e q5 q1 q2 q3 q4 q6 a17 a18 a16 a12 a19 v cc a15 ai01269 m27c801 (normal) 8 1 9 16 17 24 25 32 v ss
device description m27c801 8/24 2 device description the operating modes of the m27c801 are listed in the operating modes table. a single power supply is required in read mode. all inputs are ttl levels except for g v pp and 12v on a9 for electronic signature and margin mode set or reset. 2.1 read mode the m27c801 has two control functions, both of which must be logically active in order to obtain data at the outputs. chip enable (e ) is the power control and should be used for device selection. output enable (g ) is the output control and should be used to gate data to the output pins, independent of device selection. assuming that the addresses are stable, the address access time (t avqv ) is equal to the delay from e to output (t elqv ). data is available at the output after a delay of t glqv from the falling edge of g , assuming that e has been low and the addresses have been stable for at least t avqv -t glqv . 2.2 standby mode the m27c801 has a standby mode which reduces the supply current from 35ma to 100a. the m27c801 is placed in the standby mode by applying a cmos high signal to the e input. when in the standby mode, the outputs are in a high impedance state, independent of the g v pp input. 2.3 two-line output control because eproms are usually used in larger memory arrays, the product features a 2 line control function which accommodates the use of multiple memory connection. the two line control function allows: the lowest possible memory power dissipation, complete assurance that output bus contention will not occur. for the most efficient use of these two control lines, e should be decoded and used as the primary device selecting function, while g should be made a common connection to all devices in the array and connected to the read line from the system control bus. this table 2. operating modes (1) 1. x = v ih or v il , v id = 12v 0.5v. mode e g v pp a9 q7-q0 read v il v il xdata out output disable v il v ih x hi-z program v il pulse v pp x data in program inhibit v ih v pp x hi-z standby v ih x x hi-z electronic signature v il v il v id codes
m27c801 device description 9/24 ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device. 2.4 system considerations the power switching characteristics of advanced cmos eproms require careful decoupling of the devices. the supply current, i cc , has three segments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of e . the magnitude of the transient current peaks is dependent on the capacitive and inductive loading of the device at the output. the associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. it is recommended that a 0.1f ceramic capacitor be used on every device between v cc and v ss . this should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. in addition, a 4.7f bulk electrolytic capacitor should be used between v cc and v ss for every eight devices. the bulk capacitor should be located near the power supply connection point. the purpose of th e bulk capacitor is to overcome the voltage drop caused by the inductive effects of pcb traces. 2.5 programming when delivered (and after each erasure for uv eprom), all bits of the m27c801 are in the '1' state. data is introduced by selectively programming '0's into the desired bit locations. although only '0' will be programmed, both '1's and '0's can be present in the data word. the only way to change a '0' to a '1' is by die exposure to ultraviolet light (uv eprom). the m27c801 is in the programming mode when v pp input is at 12.75v and e is pulsed to v il . the data to be programmed is applied to 8 bits in parallel to the data output pins. the levels required for the address and data inputs are ttl. v cc is specified to be 6.25v 0.25v. 2.6 presto iib programming algorithm presto iib programming algorithm allows the whole array to be programmed with a guaranteed margin, in a typical time of 52.5 seconds. this can be achieved with stmicroelectronics m27c801 due to several design innovations to improve programming efficiency and to provide adequate margin for re liability. before starti ng the programming the internal margin mode circuit is set in order to guarantee that each cell is programmed with enough margin. then a sequence of 50 s program pulses are applied to each byte until a correct verify occurs (see figure 5 ). no overprogram pulses are applied since the verify in margin mode provides the necessary margin.
device description m27c801 10/24 figure 5. programming flowchart 2.7 program inhibit programming of multiple m27c 801s in parallel with different data is also easily accomplished. except for e , all like inputs including g v pp of the parallel m27c801 may be common. a ttl low level pulse applied to a m27c801's e input, with v pp at 12.75v, will program that m27c801. a high level e input inhibits the other m27c801s from being programmed. 2.8 program verify a verify (read) should be performed on the programmed bits to determine that they were correctly programmed. the verify is accomplished with g at v il . data should be verified with t elqv after the fa lling edge of e . 2.9 electronic signature the electronic signature (es) mode allows the reading out of a binary code from an eprom that will identify its manufacturer an d type. this mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. the es mode is functional in the 25c 5c ambient temperature range that is required when programming the m27c801. to activate ai01271b n = 0 last addr verify e = 50 s pulse ++n = 25 ++ addr v cc = 6.25v, v pp = 12.75v fail check all bytes 1st: v cc = 6v 2nd: v cc = 4.2v yes no yes no yes no set margin mode reset margin mode
m27c801 device description 11/24 the es mode, the programming equipment must force 11.5v to 12.5v on address line a9 of the m27c801. two identifier bytes may then be sequenced from the device outputs by toggling address line a0 from v il to v ih . all other address lines must be held at v il during electronic signature mode. byte 0 (a0 = v il ) represents the manufacturer code and byte 1 (a0 = v ih ) the device identifier code. for the stmicroelectronics m27c801, these two identifier bytes are given in ta b l e 3 and can be read-out on outputs q7 to q0. 2.10 erasure operation (applies to uv eprom) the erasure characteristics of the m27c801 is such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 ?. it should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 ? range. research shows that constant exposure to room level fluorescent lighting could erase a typical m27c801 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. if the m27c801 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the m27c801 window to prevent unintentional erasure. the recommended erasure procedure for the m27c801 is exposure to short wave ultraviolet light which has wavelength 2537 ?. the integrated dose (i.e. uv intensity x exposure time) for erasure should be a minimum of 30 w-sec/cm 2 . the erasure time with this dosage is approximately 30 to 40 minutes using an ultraviolet lamp with 12000 w/cm 2 power rating. the m27c801 should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. some lamps have a filter on their tubes which should be removed before erasure. table 3. electronic signature identifier a0 q7 q6 q5 q4 q3 q2 q1 q0 hex data manufacturer?s code v il 00100000 20h device code v ih 01000010 42h
maximum ratings m27c801 12/24 3 maximum ratings table 4. absolute maximum ratings (1) 1. except for the rating ?operating temperature range? , stresses above those listed in the table ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. exposure to absolute maximum ra ting conditions for extended periods may affect device reliability. refer also to the st microelectronics sure program and other relevant quality documents. symbol parameter value unit t a ambient operating temperature (2) 2. depends on range. ?40 to 125 c t bias temperature under bias ?50 to 125 c t stg storage temperature ?65 to 150 c v io (3) 3. minimum dc voltage on input or output is ?0.5v wi th possible undershoot to ?2.0v for a period less than 20ns. maximum dc voltage on output is vcc +0.5v with possible overshoot to vcc +2v for a period less than 20ns. input or output voltage (except a9) ?2 to 7 v v cc supply voltage ?2 to 7 v v a9 (3) a9 voltage ?2 to 13.5 v v pp program supply voltage ?2 to 14 v
m27c801 dc and ac characteristics 13/24 4 dc and ac characteristics t a = 0 to 70 c or ?40 to 85 c; v cc = 5v 10% t a = 25 c; v cc = 6.25v 0.25v; v pp = 12.75v 0.25v table 5. read mode dc characteristics (1) 1. v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . symbol parameter test co ndition min. max. unit i li input leakage current 0v v in v cc 10 a i lo output leakage current 0v v out v cc 10 a i cc supply current e = v il , g v pp = v il , i out = 0ma, f = 5mhz 35 ma i cc1 supply current (standby) ttl e = v ih 1ma i cc2 supply current (standby) cmos e > v cc ? 0.2v 100 a i pp program current v pp = v cc 10 a v il input low voltage ?0.3 0.8 v v ih (2) 2. maximum dc voltage on output is v cc +0.5v. input high voltage 2 v cc + 1 v v ol output low voltage i ol = 2.1ma 0.4 v v oh output high voltage ttl i oh = ?1ma 3.6 v output high voltage cmos i oh = ?100 av cc ? 0.7 v table 6. programming mode dc characteristics (1) 1. v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . symbol parameter test condition min. max. unit i li input leakage current v il v in v ih 10 a i cc supply current 50 ma i pp program current e = v il 50 ma v il input low voltage ?0.3 0.8 v v ih input high voltage 2 v cc + 0.5 v v ol output low voltage i ol = 2.1ma 0.4 v v oh output high voltage ttl i oh = ?1ma 3.6 v v id a9 voltage 11.5 12.5 v
dc and ac characteristics m27c801 14/24 t a = 25 c, f = 1 mhz figure 6. ac testing input output waveform figure 7. ac testing load circuit table 7. ac measurement conditions parameter high speed standard input rise and fall times 10ns 20ns (10% to 90%) input pulse voltages 0 to 3v 0.4 to 2.4v input and output timing ref. voltages 1.5v 0.8 and 2v table 8. capacitance (1) 1. sampled only, not 100% tested. symbol parameter test condition min. max. unit c in input capacitance v in = 0v 6 pf c out output capacitance v out = 0v 12 pf ai01822 3v high speed 0v 1.5v 2.4v standard 0.4v 2.0v 0.8v ai01823b 1.3v out c l c l = 30pf for high speed c l = 100pf for standard c l includes jig capacitance 3.3k ? 1n914 device under test
m27c801 dc and ac characteristics 15/24 t a = 0 to 70 c or ?40 to 85 c; v cc = 5v 10% figure 8. read mode ac waveforms table 9. read mode ac characteristics (1) symbol alt parameter test condition -45 (2) -55 (2) -60 unit min. max. min. max. min. max. t avqv t acc address valid to output valid e = v il , g v pp = v il 45 55 60 ns t elqv t ce chip enable low to output valid g v pp = v il 45 55 60 ns t glqv t oe output enable low to output valid e = v il 25 30 30 ns t ehqz (3) t df chip enable high to output hi-z g v pp = v il 025025025ns t ghqz (3) t df output enable high to output hi-z e = v il 025025025ns t axqx t oh address transition to output tr a n s i t i o n e = v il , g v pp = v il 000ns 1. v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . 2. speed obtained with high speed ac measurement conditions. 3. sampled only, not 100% tested. table 10. read mode ac characteristics (1) symbol alt parameter test condition -70 -80 -100/-120/-150 unit min. max. min. max. min max. t avqv t acc address valid to output valid e = v il , g v pp = v il 70 80 100 ns t elqv t ce chip enable low to output valid g v pp = v il 70 80 100 ns t glqv t oe output enable low to output valid e = v il 35 40 50 ns t ehqz (2) t df chip enable high to output hi-z g v pp = v il 030035 0 40ns t ghqz (2) t df output enable high to output hi-z e = v il 030035 0 40ns t axqx t oh address transition to output transition e = v il , g v pp = v il 00 0 ns 1. v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . 2. sampled only, not 100% tested. ai01583b taxqx tehqz a0-a19 e g q0-q7 tavqv tghqz tglqv telqv valid hi-z valid
dc and ac characteristics m27c801 16/24 t a = 25 c; v cc = 6.25v 0.25v; v pp = 12.75v 0.25v figure 9. margin mode ac waveforms table 11. margin mode ac characteristics (1) symbol alt parameter test condition min max unit t a9hvph t as9 v a9 high to v pp high 2 s t vphel t vps v pp high to chip enable low 2 s t a10heh t as10 v a10 high to chip enable high (set) 1 s t a10leh t as10 v a10 low to chip enable high (reset) 1 s t exa10x t ah10 chip enable transition to v a10 transition 1 s t exvpx t vph chip enable transition to v pp transition 2 s t vpxa9x t ah9 v pp transition to v a9 transition 2 s 1. v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . ai00736b ta9hvph tvpxa9x a8 e gv pp a10 set v cc tvphel ta10leh texvpx ta10heh a9 a10 reset texa10x
m27c801 dc and ac characteristics 17/24 figure 10. programming and verify modes ac waveforms table 12. programming mode ac characteristics (1) symbol alt parameter test condition min. max. unit t avel t as address valid to chip enable low 2 s t qvel t ds input valid to chip enable low 2 s t vchel t vcs v cc high to chip enable low 2 s t vphel t oes v pp high to chip enable low 2 s t vplvph t prt v pp rise time 50 ns t eleh t pw chip enable program pulse width (initial) 45 55 s t ehqx t dh chip enable high to input transition 2 s t ehvpx t oeh chip enable high to v pp transition 2 s t vplel t vr v pp low to chip enable low 2 s t elqv t dv chip enable low to output valid 1 s t ehqz (2) t dfp chip enable high to output hi-z 0 130 ns t ehax t ah chip enable high to address transition 0 ns 1. v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . 2. sampled only, not 100% tested. tavel valid ai01270 a0-a19 q0-q7 v cc data in data out e tqvel tvchel tvphel tehqx tehvpx telqv teleh tehqz tvplel program verify gv pp tehax
package mechanical data m27c801 18/24 5 package mechanical data 5.1 32-pin ceramic frit-seal dip, with round window (fdip32wa) figure 11. fdip32wa package outline table 13. fdip32wa package mechanical data symbol millimeters inches min typ max min typ max a5.720.225 a1 0.51 1.40 0.020 0.055 a2 3.91 4.57 0.154 0.180 a3 3.89 4.50 0.153 0.177 b 0.41 0.56 0.016 0.022 b1 1.45 0.057 c 0.23 0.30 0.009 0.012 d 41.73 42.04 1.643 1.655 d2 38.10 1.500 e 2.54 0.100 e 15.24 0.600 e1 13.06 13.36 0.514 0.526 ea 14.99 0.590 eb 16.18 18.03 0.637 0.710 l 3.18 4.10 0.125 0.161 n32 32 s 1.52 2.49 0.060 0.098 ? 7.11 0.280 4 11 4 11 fdipw-a a3 a1 a l b1 b e d s e1 e n 1 c ea d2 ? eb a2
m27c801 package mechanical data 19/24 5.2 32-pin plastic dip, 600 mils width (pdip32) figure 12. pdip32 package outline table 14. pdip32 package mechanical data symbol millimeters inches min typ max min typ max a4.830.190 a1 0.38 0.015 a2 3.81 0.150 b 0.41 0.53 0.016 0.021 b1 1.14 1.65 0.045 0.065 c 0.23 0.38 0.009 0.015 d 41.78 42.29 1.645 1.665 d2 38.10 1.500 ea 15.24 0.600 e 2.54 0.100 e 15.24 15.88 0.600 0.625 e1 13.46 13.97 0.530 0.550 s 1.65 2.21 0.065 0.087 l 3.05 3.56 0.120 0.140 0 15 0 15 n32 32 pdip-c a2 a1 a l b1 b e d s e1 e n 1 c ea d2
package mechanical data m27c801 20/24 5.3 32-lead rectangular plastic leaded chip carrier (plcc32) figure 13. plcc32 package outline table 15. plcc32 package mechanical data symbol millimeters inches min typ max min typ max a 3.18 3.56 0.125 0.140 a1 1.53 2.41 0.060 0.095 a2 0.38 ? 0.015 ? b 0.33 0.53 0.013 0.021 b1 0.66 0.81 0.026 0.032 cp 0.10 0.004 d 12.32 12.57 0.485 0.495 d1 11.35 11.51 0.447 0.453 d2 4.78 5.66 0.188 0.223 d3 7.62 0.300 e 14.86 15.11 0.585 0.595 e1 13.89 14.05 0.547 0.553 e2 6.05 6.93 0.238 0.273 e3 10.16 0.400 e 1.27 0.050 f 0.00 0.13 0.000 0.005 r 0.89 0.035 n32 32 plcc-a d e3 e1 e 1 n d1 d3 cp b e2 e b1 a1 a r 0.51 (.020) 1.14 (.045) f a2 e2 d2 d2
m27c801 package mechanical data 21/24 5.4 32-lead plastic thin small outline, 8x20 mm (tsop32) figure 14. tsop32 package outline table 16. tsop32 package mechanical data symbol millimeters inches min typ max min typ max a 1.200 0.0472 a1 0.050 0.150 0.0020 0.0059 a2 0.950 1.050 0.0374 0.0413 b 0.170 0.250 0.0067 0.0098 c 0.100 0.210 0.0039 0.0083 cp 0.100 0.0039 d 19.800 20.200 0.7795 0.7953 d1 18.300 18.500 0.7205 0.7283 e 0.500 0.0197 e 7.900 8.100 0.3110 0.3189 l 0.500 0.700 0.0197 0.0276 n32 32 0 5 0 5 tsop-a d1 e 1 n cp b e a2 a n/2 d die c l a1
part numbering m27c801 22/24 6 part numbering table 17. ordering information scheme for a list of available options (speed, package, etc...) or for further information on any aspect of this device, please contact the st microelectronics sales office nearest to you. example: m27c801 -45 k 1 device type m27 supply voltage c = 5v 10% device function 801 = 8mbit (1mb x8) speed -45 (1) = 45 ns -80 = 80 ns 1. high speed, see ac characteristi cs section for further information. -55 (1) = 55 ns -100 = 100 ns -60 = 60 ns -120 = 120 ns -70 = 70 ns -150 = 150 ns package f = fdip32w b = pdip32 k = plcc32 n = tsop32: 8 x 20 mm temperature range 1 = 0 to 70 c 6 = ?40 to 85 c
m27c801 revision history 23/24 7 revision history table 18. document revision history date revision changes 10-sept-1998 1 first issue 21-mar-2000 2 fdip32w package changed 25-sep-2000 3 an620 reference removed 12-jul-2002 4 55ns speed class added plcc32 package mechanical drawing and data clarified 12-apr-2006 5 converted to new template. added ecopack? information. removed tape & reel packing option.
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